L40 半导体分立器件综合 标准查询与下载
共找到 1197 条与 半导体分立器件综合 相关的标准，共 80 页
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2024-03-15
- 实施
- 2024-07-01
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopic examination of plastically encapsulated electronic components
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2024-03-15
- 实施
- 2024-07-01
Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-09-07
- 实施
- 2024-04-01
Semiconductor Devices Discrete Devices Part 7: Bipolar Transistors
- ICS
- 31.080.30
- CCS
- L40
- 发布
- 2023-09-07
- 实施
- 2024-04-01
Semiconductor devices microelectromechanical devices Part 19: Electronic compass
- ICS
- 31.200
- CCS
- L40
- 发布
- 2023-08-06
- 实施
- 2024-03-01
Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Microelectromechanical Devices for Semiconductor Devices Part 5: RF MEMS Switches
- ICS
- 31.200
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-09-01
Semiconductor devices microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection
- ICS
- 31.200
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Mechanical and Climatic Test Methods for Semiconductor Devices Part 27: Electrostatic Discharge (ESD) Susceptibility Test Machine Model (MM)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
本文件描述了电子元器件在实际贮存条件下随时间推移的退化机理和退化方式,以及评估一般退化机理的试验方法。通常本文件与IEC6 2
Long-term storage of electronic components and semiconductor devices Part 2: Degradation mechanisms
- ICS
- 31.020
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-09-01
本文件规定了单个芯片、部分晶圆或整个晶圆,以及带金属结构(引入金属层、植球植柱等)芯片的贮存条件和规则,同时为含有芯片或晶圆的通用和专用封装产品提供了操作指导。 本文件适用于预计贮存时间超过1 2个月的芯片和晶圆的长期贮存。
Long-term storage of electronic components and semiconductor devices - Part 5: Chips and wafers
- ICS
- 31.080
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-09-01
Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Mechanical and climatic test methods for semiconductor devices Part 32: Flammability of plastic encapsulated devices (externally induced)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2023-05-23
- 实施
- 2023-12-01
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
- ICS
- 31.080.01
- CCS
- L40
- 发布
- 2018-09-17
- 实施
- 2019-01-01 00:00:00.0
